When it comes to high-power applications with strict reliability requirements, HV-IGBTs in the well-known std-type package remain the best option. This article explains why and how this traditional package is being elevated to the next level by a variety of innovative technologies.
The development and commercialization of IGBT power modules for high voltage ratings such as 2500 V and 3300 V began in the second half of the 1990s. Originally, these HV-IGBTs were intended to be GTO replacements for high-power, high-reliability applications such as railway traction inverters. Furthermore, it has been used in a variety of other high-power applications.
The device package that was used back then had the same outline as today’s HV-IGBT power modules. It is a standard-type package with a rectangular footprint of 190 mm x 140 mm.
The standard-type package has a large current capacity, which is an advantage. Furthermore, as a single-switch device, it provides a high degree of flexibility for complex converter topologies. As a result, MITSUBISHI ELECTRIC continues to develop power modules in standard-type packages, incorporating the most recent chip and package technology.
Standard-type power modules with the cutting-edge X-Series chip set are now available in voltage classes ranging from 1700 V to 6500 V.
Std-type package with latest X-Series chip technology with 190x140mm² and 130x140mm² footprint packages. Image used courtesy Bodo’s Power Systems
When compared to previous generations, the efficiency, power density, and robustness of these power modules improved.
Applications for Standard-Type Hv-Igbts
HVDC
High-voltage DC (HVDC) systems based on IGBT modules have matured as a technology for bulk-power electricity transmission. In comparison to traditional thyristor-based transmission systems, they allow for more compact plant design and more flexible operation.
DC transmission currents in cutting-edge HVDC systems exceed 2 kA.
STATCOM
The proportion of renewable energy sources in our electricity grid is steadily increasing. Simultaneously, in relation to the CO2 reduction goal, the share of coal generation is declining. The loss of inertia caused by large generators, combined with fluctuating power generation from renewables, makes network stabilization more difficult.
STATCOMs (Static Synchronous Compensators) can help to stabilize a network by providing reactive power, active filtering, flicker reduction, and frequency stabilization. MMC-based STATCOMs are highly modular. Single converter branches, for example, can provide 400 MVA of inductive or capacitive reactive power.
Medium-Voltage Drives
Medium-voltage (MV) drives allow high-power motors and generators with voltages of 3.3 kV or higher to be controlled at high speeds. Offshore wind generation, mills, conveyor belts, compressors, and ship propulsion are all examples of applications for these drive systems. These drives are typically subjected to stringent reliability standards. When recovering electric energy, bidirectional power flow is frequently required.
Multilevel converter topologies, such as 3-level NPC converter or other 5- or 7-level topologies, are frequently used for such MV drives. All of the applications listed above have one thing in common: they all require IGBT power modules with a high current capability.
Furthermore, end users have high expectations for the reliability and robustness of semiconductor power modules. The busbar design becomes difficult, especially when considering 3-, 5-, or 7-level converter topologies. As a result, when designing the converter, semiconductor power modules should allow as much flexibility as possible.
The three examples above demonstrate that standard-type packages are still the preferred choice for many applications. Large output currents of up to 2400 A are possible in the 130×140 mm2 standard-type package. Furthermore, in decades of field operation, the package outline has proven its suitability.
The “1-in-1” single-switch power modules were originally included in the standard-type package. Single-switches provide the most flexibility in converter design, which is especially important in multi-level topologies.
Another application is the development or refurbishment of existing converter platforms. The new standard-type power modules have an outline that is compatible with previous generations of power modules. As a result, upgrading to a newer generation of IGBT modules is simple. Newer IGBT generations provide higher output current, higher power cycling capability, and humidity resistance.
Using High-Voltage IGBT Modules for High-Power Applications
When it comes to high-power applications with strict reliability requirements, HV-IGBTs in the well-known std-type package remain the best option. This article explains why and how this traditional package is being elevated to the next level by a variety of innovative technologies.
The development and commercialization of IGBT power modules for high voltage ratings such as 2500 V and 3300 V began in the second half of the 1990s. Originally, these HV-IGBTs were intended to be GTO replacements for high-power, high-reliability applications such as railway traction inverters. Furthermore, it has been used in a variety of other high-power applications.
The device package that was used back then had the same outline as today’s HV-IGBT power modules. It is a standard-type package with a rectangular footprint of 190 mm x 140 mm.
The standard-type package has a large current capacity, which is an advantage. Furthermore, as a single-switch device, it provides a high degree of flexibility for complex converter topologies. As a result, MITSUBISHI ELECTRIC continues to develop power modules in standard-type packages, incorporating the most recent chip and package technology.
Standard-type power modules with the cutting-edge X-Series chip set are now available in voltage classes ranging from 1700 V to 6500 V.
Std-type package with latest X-Series chip technology with 190x140mm² and 130x140mm² footprint packages. Image used courtesy Bodo’s Power Systems
When compared to previous generations, the efficiency, power density, and robustness of these power modules improved.
Applications for Standard-Type Hv-Igbts
HVDC
High-voltage DC (HVDC) systems based on IGBT modules have matured as a technology for bulk-power electricity transmission. In comparison to traditional thyristor-based transmission systems, they allow for more compact plant design and more flexible operation.
DC transmission currents in cutting-edge HVDC systems exceed 2 kA.
STATCOM
The proportion of renewable energy sources in our electricity grid is steadily increasing. Simultaneously, in relation to the CO2 reduction goal, the share of coal generation is declining. The loss of inertia caused by large generators, combined with fluctuating power generation from renewables, makes network stabilization more difficult.
STATCOMs (Static Synchronous Compensators) can help to stabilize a network by providing reactive power, active filtering, flicker reduction, and frequency stabilization. MMC-based STATCOMs are highly modular. Single converter branches, for example, can provide 400 MVA of inductive or capacitive reactive power.
Medium-Voltage Drives
Medium-voltage (MV) drives allow high-power motors and generators with voltages of 3.3 kV or higher to be controlled at high speeds. Offshore wind generation, mills, conveyor belts, compressors, and ship propulsion are all examples of applications for these drive systems. These drives are typically subjected to stringent reliability standards. When recovering electric energy, bidirectional power flow is frequently required.
Multilevel converter topologies, such as 3-level NPC converter or other 5- or 7-level topologies, are frequently used for such MV drives. All of the applications listed above have one thing in common: they all require IGBT power modules with a high current capability.
Furthermore, end users have high expectations for the reliability and robustness of semiconductor power modules. The busbar design becomes difficult, especially when considering 3-, 5-, or 7-level converter topologies. As a result, when designing the converter, semiconductor power modules should allow as much flexibility as possible.
The three examples above demonstrate that standard-type packages are still the preferred choice for many applications. Large output currents of up to 2400 A are possible in the 130×140 mm2 standard-type package. Furthermore, in decades of field operation, the package outline has proven its suitability.
The “1-in-1” single-switch power modules were originally included in the standard-type package. Single-switches provide the most flexibility in converter design, which is especially important in multi-level topologies.
Another application is the development or refurbishment of existing converter platforms. The new standard-type power modules have an outline that is compatible with previous generations of power modules. As a result, upgrading to a newer generation of IGBT modules is simple. Newer IGBT generations provide higher output current, higher power cycling capability, and humidity resistance.
